On the first stage of the work the influence of selected technological modes of formation on the properties of composite materials based on epoxy-diane resin ED-20 and modifier 4,4-sulfonilbis(4,1-phenylene)bis(N,N-diethyldithiocarbamate) was investigated. As a result of analysis of the received data the optimal input mode of modifier into epoxy resin was selected and the forming technology of modified epoxy matrix was developed. On the second stage of the work the influence of amount of modifier 4,4-sulfonilbis(4,1-phenylene)bis (N,N-diethyldithiocarbamate) on adhesive properties of the modified matrix, which interacts with the aluminum base D16 and AMg5 grades and also steel base St 3 was investigated. The optimal content of the modifier to form a matrix, having an improved adhesive strength relative to the aluminum base, was set. It is shown that the input of modifier in amount of q =1,50…1,75 wt % into the epoxy binder ensures the formation of a material that differs with the following adhesive strength under tearing: σ =51,3…55,5 MPa (base made of aluminum D16 grade), σ =52,7…54,1 MPa (base made of aluminum AMg5 grade). To form the matrix with optimal adhesive properties relative to the steel base St 3 grade the modifier in amount of q =0,25 wt % must be input into the binder. This material is characterized by the following properties: adhesive strength under tearing σ =41,9 MPa, adhesive strength under shear τ =8,6 MPa, residual stresses σ =2,2 МPа.